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Micro-Tec P{100} silicon wafer Ø2inch/51mm – 275µm thickness
Micro-Tec P{100} silicon wafer Ø2inch/51mm – 275µm thickness (each)
£25.66
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GD-010 glow discharge
Glow discharge attachment for hydrophilic/hydrophobic treatment (rendering) of substrates (e.g. TEM carbon support films). Fully integrated to allow post-treatment of carbon films without the need to break vacuum after carbon coating
Price On Request £0.00 Add to basket
GD-010 glow discharge
Glow discharge attachment for hydrophilic/hydrophobic treatment (rendering) of substrates (e.g. TEM carbon support films). Fully integrated to allow post-treatment of carbon films without the need to break vacuum after carbon coating
£0.00Price On Request -
Micro-Tec diced P {100} 4inch/100mm silicon wafer-diced in 10 x 10mm chips, 525µm thick-55 Chips
Micro-Tec diced P{100} Ø4inch/100mm silicon wafer, diced in 10 x 10mm chips, 525µm thickness ~ 55 Chips (each)
£81.61 Add to basket
Micro-Tec diced P {100} 4inch/100mm silicon wafer-diced in 10 x 10mm chips, 525µm thick-55 Chips
Micro-Tec diced P{100} Ø4inch/100mm silicon wafer, diced in 10 x 10mm chips, 525µm thickness ~ 55 Chips (each)
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Diced P{100} Ø4″/100mm Si wafer, 5 x 5mm chips – 525µm thick
Micro-Tec diced P{100} Ø4inch/100mm silicon wafer, diced in 5 x 5mm chips – 525µm thickness ~270 Chips (each)
£81.79 Add to basket
Diced P{100} Ø4″/100mm Si wafer, 5 x 5mm chips – 525µm thick
Micro-Tec diced P{100} Ø4inch/100mm silicon wafer, diced in 5 x 5mm chips – 525µm thickness ~270 Chips (each)
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SP-010 sputtering module
Fully integrated magnetron (type A) sputtering module for standard sputtering rates. Including high resolution sputtering assembly. Fitted with target cooling and monitoring – automatic source shutter and electronically controlled process vacuum control. Note: sputtering target not included – please select required metat target(s) from the options list.
Price On Request £0.00 Add to basket
SP-010 sputtering module
Fully integrated magnetron (type A) sputtering module for standard sputtering rates. Including high resolution sputtering assembly. Fitted with target cooling and monitoring – automatic source shutter and electronically controlled process vacuum control. Note: sputtering target not included – please select required metat target(s) from the options list.
£0.00Price On Request