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Micro-Tec diced P {100} 4inch/100mm silicon wafer-diced in 10 x 10mm chips, 525µm thick-55 Chips
Micro-Tec diced P{100} Ø4inch/100mm silicon wafer, diced in 10 x 10mm chips, 525µm thickness ~ 55 Chips (each)
£81.61
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P{100} silicon wafer- Ø4 inch/100mm- 525µm thickness
Micro-Tec P{100} silicon wafer, Ø4 inch/100mm – 525µm thickness (each)
£37.29 Add to basket
P{100} silicon wafer- Ø4 inch/100mm- 525µm thickness
Micro-Tec P{100} silicon wafer, Ø4 inch/100mm – 525µm thickness (each)
£37.29 -
ET-010 integrated plasma stage
Plasma cleaning accessory for the pre-treatment (cleaning) or after-treatment (glow discharge effect) of specimens in combination with a coating process.
Price On Request £0.00 Add to basket
ET-010 integrated plasma stage
Plasma cleaning accessory for the pre-treatment (cleaning) or after-treatment (glow discharge effect) of specimens in combination with a coating process.
£0.00Price On Request -
Micro-Tec diced P{100} diameter: 4inch/100mm silicon wafer
Micro-Tec diced P{100} diameter 4inch/100mm silicon wafer, diced in 7.5 x 7.5mm chips – 525um thickness ~112 Chips (each)
£79.28 Add to basket
Micro-Tec diced P{100} diameter: 4inch/100mm silicon wafer
Micro-Tec diced P{100} diameter 4inch/100mm silicon wafer, diced in 7.5 x 7.5mm chips – 525um thickness ~112 Chips (each)
£79.28 -
GD-010 glow discharge
Glow discharge attachment for hydrophilic/hydrophobic treatment (rendering) of substrates (e.g. TEM carbon support films). Fully integrated to allow post-treatment of carbon films without the need to break vacuum after carbon coating
Price On Request £0.00 Add to basket
GD-010 glow discharge
Glow discharge attachment for hydrophilic/hydrophobic treatment (rendering) of substrates (e.g. TEM carbon support films). Fully integrated to allow post-treatment of carbon films without the need to break vacuum after carbon coating
£0.00Price On Request