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Micro-Tec P{100} silicon wafer Ø2inch/51mm – 275µm thickness
Micro-Tec P{100} silicon wafer Ø2inch/51mm – 275µm thickness (each)
£25.66
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Ultra-flat P{100} silicon- 200nm thermal SiO2 chips- 5 x 5mm
Nano-Tec ultra-flat P{100} silicon with 200nm thermal SiO2 chips, 5 x 5mm, 25 each in gel pack – 675µm thickness (pkg/25)
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Ultra-flat P{100} silicon- 200nm thermal SiO2 chips- 5 x 5mm
Nano-Tec ultra-flat P{100} silicon with 200nm thermal SiO2 chips, 5 x 5mm, 25 each in gel pack – 675µm thickness (pkg/25)
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Ultra-flat P{100} silicon wafer, Ø4″/100mm – 525µm thickness
Nano-Tec ultra-flat P{100} silicon wafer, Ø4inch/100mm – 525µm thickness (each)
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Ultra-flat P{100} silicon wafer, Ø4″/100mm – 525µm thickness
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SP-010 sputtering module
Fully integrated magnetron (type A) sputtering module for standard sputtering rates. Including high resolution sputtering assembly. Fitted with target cooling and monitoring – automatic source shutter and electronically controlled process vacuum control. Note: sputtering target not included – please select required metat target(s) from the options list.
Price On Request £0.00 Add to basket
SP-010 sputtering module
Fully integrated magnetron (type A) sputtering module for standard sputtering rates. Including high resolution sputtering assembly. Fitted with target cooling and monitoring – automatic source shutter and electronically controlled process vacuum control. Note: sputtering target not included – please select required metat target(s) from the options list.
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Micro-Tec diced P{100} diameter: 4inch/100mm silicon wafer
Micro-Tec diced P{100} diameter 4inch/100mm silicon wafer, diced in 7.5 x 7.5mm chips – 525um thickness ~112 Chips (each)
£79.28 Add to basket
Micro-Tec diced P{100} diameter: 4inch/100mm silicon wafer
Micro-Tec diced P{100} diameter 4inch/100mm silicon wafer, diced in 7.5 x 7.5mm chips – 525um thickness ~112 Chips (each)
£79.28