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Diced P{100} Ø4″/100mm Si wafer, 5 x 5mm chips – 525µm thick
Micro-Tec diced P{100} Ø4inch/100mm silicon wafer, diced in 5 x 5mm chips – 525µm thickness ~270 Chips (each)
£81.79
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Price On Request £0.00 Add to basket
ET-010 integrated plasma stage
Plasma cleaning accessory for the pre-treatment (cleaning) or after-treatment (glow discharge effect) of specimens in combination with a coating process.
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SP-011 sputtering module for high sputtering rates
SP-011 sputtering head module for applications where high sputtering rates are required
Price On Request £0.00 Add to basket
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Micro-Tec diced P{100} diameter: 4inch/100mm silicon wafer
Micro-Tec diced P{100} diameter 4inch/100mm silicon wafer, diced in 7.5 x 7.5mm chips – 525um thickness ~112 Chips (each)
£79.28 Add to basket
Micro-Tec diced P{100} diameter: 4inch/100mm silicon wafer
Micro-Tec diced P{100} diameter 4inch/100mm silicon wafer, diced in 7.5 x 7.5mm chips – 525um thickness ~112 Chips (each)
£79.28 -
Coating LAB software
Coating LAB Windows-based software can be installed on a laptop for monitoring and documenting coating processes. Fully automatic logs and charts containing all process-related data can be exported as screenshots or CSV files for Office applications. Available information includes process vacuum, current and voltage along with film thickness and coating rates (Internet connection required). Coating-LAB will allow remote service access for error diagnosis and process optimisation.
Price On Request £0.00 Add to basket
Coating LAB software
Coating LAB Windows-based software can be installed on a laptop for monitoring and documenting coating processes. Fully automatic logs and charts containing all process-related data can be exported as screenshots or CSV files for Office applications. Available information includes process vacuum, current and voltage along with film thickness and coating rates (Internet connection required). Coating-LAB will allow remote service access for error diagnosis and process optimisation.
£0.00Price On Request